The purpose of using red glue in SMT patch stencil

1) Prevent components from falling off during wave soldering (wave soldering process)

2) Prevent components on the other side from falling off during reflow soldering (double-sided reflow soldering process)

3) Prevent component displacement and tombstone (reflow soldering process, pre-coating process)

4) Marking (wave soldering, reflow soldering, pre-coating)

5) When using wave soldering, in order to prevent the components from falling when the printed board passes through the solder tank, fix the components on the printed board.

6) In the double-sided reflow soldering process, in order to prevent the large components on the soldered side from falling off due to the melting of the solder, SMT adhesive should be used.

7) Used in reflow soldering process and pre-coating process to prevent displacement and stand-up during mounting.

8) In addition, when printed boards and components are changed in batches, use patch glue for marking.

SMT glue, also known as SMT adhesive, SMT red glue, is an adhesive that evenly distributes hardeners, pigments, solvents, etc. in the red paste, and is mainly used to fix components on printed boards , generally dispensed by dispensing or stencil printing. After pasting the components, put them into an oven or a reflow soldering machine to heat and harden. It is different from the so-called solder paste. Once heated and hardened, it will not melt when heated again. That is to say, the thermal hardening process of the adhesive is irreversible. The use effect of SMT patch adhesive will vary due to different heat curing conditions, objects to be connected, equipment used, and operating environment. When using, the adhesive should be selected according to the production process.

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