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Defect type Possible cause

Solder paste to pad displacement PCB and stencil misalignment, bad stencil or circuit board.

Solder paste bridge Too much tin, too large opening/close contact with circuit board PAD

The solder paste is blurred. The stencil claims that there is solder paste on its surface, and the scraper speed is too fast.

The area of solder paste is reduced, the pressure of the squeegee is too high, and the holes are damaged

The solder paste area is too large, the stencil is deformed, and the space between it and the circuit board is dirty

Excessive amount of solder paste, height too high Dried solder paste in the hole in the wall

Solder paste sinks Squeegee too fast, solder paste temperature is too high, moisture inhaled

The height of the solder paste changes greatly, the stencil is deformed, the squeegee is too fast, and the separation control is too fast

The amount of solder paste is small, the scraper is too fast, and the plastic scraper buckle scrapes out the solder paste

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