1.Basic courses:

1. The principle of mechanical and electrical integration, the application of ergonomics, the principle and control of pneumatics.

2. Optical (CCD camera, laser projection).

3. Physics, physical chemistry, metallurgy (wetting, viscosity, capillary phenomenon, heat conduction, diffusion, dissolution, alloy, alloy layer, metallography, aging phenomenon, soldering principle).

4. Chemistry and chemical materials (decomposition, oxidation, reduction, electrode potential, flux, solvent, diluent, activator, slow release agent).

5. Computer and automatic control, sensor principle and application.

6. Mechanical drawing and metalworking practice.

7. Electrical and electronic technology (electrical engineering, analog circuit, digital circuit) electrical and electronic technology practice;

8. Electrical and electronic materials and components, electronic measurement technology, single-chip microcomputer principle and application technology, electronic CAD, and master a practical design software.

9. Material mechanics [strength (tensile force, peel resistance, fatigue), stress concentration].

10. The preparation of electronic product process documents and the design and production of tooling and molds.

11. Professional English for radio and electronic technology.

12. Quality management.

13. Standardized knowledge.

2. Professional courses:

1) Components

Packaging technology: material and structure size, welding end form, solder resistance;

  Manufacturing Technology;

Packaging technology: tape, tube, tray, bulk;

2) Substrate technology: single, double-sided, multi-layer printed boards, ceramic substrates, metal substrates, PTFE-based boards

3) Assembly materials: adhesive, solder resist, solder paste, solder wire, solder ball, solder tab, rod solder, flux, cleaning agent

4) Assembly design: electrical, structure, heat dissipation, electromagnetic compatibility, wiring and component layout, land pattern and manufacturability design

5) Assembly equipment: coating equipment, mounting equipment, welding equipment, cleaning equipment, testing equipment, testing equipment, repair equipment

6) Assembly process

Coating Technology: Solder Paste Printing or Dispensing Adhesive Process

Assembly technology: various assembly processes

Welding technology: reflow welding, wave soldering, laser welding process

Cleaning technology: solvent cleaning, water cleaning, no-cleaning process

Inspection technology: process inspection and solder joint and functional inspection of assembled boards, appearance (optical) inspection, X-ray inspection, online test, functional inspection

Repair technology: various connectors, SMD removal/replacement (soldering), BGA ball mounting

7) Anti-static technology: from R&D, procurement, transportation, external inspection, screening, assembly, debugging, aging, inspection to packaging, anti-static measures throughout the entire process of R&D and production.

8) Electronic product manufacturing process, electronic product structure, electronic product production line, electronic product debugging, electronic product aging and environmental testing, product certification and 3C compulsory certification

9) Design documents and process documents of electronic products, circuit design automation and EDA applications, electronic engineering drawings, electronic product process documents

10) Process management, quality management and standardization of electronic product manufacturing process.